China AI ObservatoryXDFOI production statusvendor
Company reports that its high-density heterogeneous-integration platform reached volume production
As of 2026-06-30JCET Group · 2026 half-year report (source)Company dossier · Reviewed 2026-09-15
JCET 长电科技
Outsourced assembly, test, and advanced packaging.
What the evidence says
JCET's half-year report provides company evidence of XDFOI volume production and customer validation of silicon-photonics engine samples. It does not establish frontier compute-plus-HBM package yield, capacity, thermal performance or domestic input provenance.
JCET Group · 2026 half-year report (source)JCET research team · XDFOI packaging manufacturability research (source)Critical facts
Computing-electronics mixvendor
First-half computing-electronics revenue grew 40.4% year over year and represented 30.1% of company revenue.
As of 2026-06-30JCET Group · 2026 half-year report (source)Silicon-photonics validationvendor
Company reports delivering XDFOI-based silicon-photonics engine samples that passed customer validation and working with multiple customers on packaging, thermal and reliability optimization; volume and capacity were not disclosed.
As of 2026-06-30JCET Group · 2026 half-year report (source)Company news
Timeline →vendor
JCET reports XDFOI volume production and silicon-photonics customer validation
JCET's half-year report says its XDFOI high-density heterogeneous-integration platform reached volume production and XDFOI-based silicon-photonics engine samples passed customer validation. Computing-electronics revenue grew 40.4% year over year to 30.1% of company revenue.
Why it matters. The filing advances the record from research capability to company-reported production and customer validation. It does not disclose frontier compute-plus-HBM package yield, capacity, thermal performance or the production volume of silicon-photonics products.
JCET Group · 2026 half-year report (source)