Industry intelligence · China

AI hardware,
from ambition to evidence.

Useful domestic AI compute is advancing faster than full supply-chain independence.

Inference and networking lead. HBM and production equipment constrain scale. Read the outlook →

32Companies & institutes
12Layers of the stack
72Attributed sources
2026-09-22Latest research review

The company index

Open a profile for the evidence, dependencies, and next milestones. Priority indicates research attention, not an investment rating.

CompanyStack layerCritical data pointReview
ACM Research Shanghai盛美上海SCREEN / TELProcess equipmentStrategic role

Semiconductor cleaning and other process tools

vendor [1] (source)
Commercial
Shanghai AishengnaASML / NikonLithographyProduction milestone

Initial tool manufacturing reported in July 2026

reported [1] (source)
Development
AMEC中微公司Lam Research / Applied MaterialsProcess equipmentEtch deployment scale

Company reports three ICP etch product families in volume production on lines at more than 50 customers

vendor [1] (source)
Commercial
Biren壁仞科技NVIDIA / AMDAI acceleratorsAI software stackStrategic role

AI GPU hardware and systems

vendor [1] (source)
Scaling
Cambricon寒武纪NVIDIA / Google TPUAI acceleratorsAI software stackCurrent product

590; prospective 690 remains separate

reported [1] (source)[2] (source)
Commercial
CIOMP长春光机所Zeiss research ecosystemOptics & light sourcesLithographyResearch role

Precision optics relevant to domestic lithography

primary [1] (source)[2] (source)
Research
CXMT长鑫存储SK hynix / Samsung / MicronMemory & storageHBM milestone

Small-volume HBM3E reportedly produced in August 2026

reported [1] (source)[2] (source)
Scaling
Empyrean华大九天Synopsys / Cadence / Siemens EDADesign softwareCoverage

Growing design and verification portfolio

vendor [1] (source)
Commercial
Enflame燧原科技NVIDIA / AMDAI acceleratorsAI software stackCustomer concentration

83.79% of 2025 revenue linked to Tencent

reported [1] (source)[2] (source)
Scaling
Eoptolink新易盛CoherentOptical networkingComponent provenance

1.6T designs use Broadcom optical DSPs

vendor [1] (source)[2] (source)
Commercial
Beijing Guowang北京国望光学ZeissOptics & light sourcesEvidence base

Published optical-system patent

primary [1] (source)
Development
H3C新华三NVIDIA networking / Cisco / AristaNetworking & interconnectsDeployment evidence

H3C reports a deployed DDC lossless-network project with Xiaohongshu and participation in G-Link and ODCC standards work; no matched InfiniBand workload result was disclosed.

primary [1] (source)
Commercial
Huawei华为NVIDIA / Google TPUAI acceleratorsNetworking & interconnectsAI software stackNext product gate

Ascend 950DT: expected Q4 2026

reported [1] (source)[2] (source)
Commercial
Hwatsing华海清科Applied Materials / EbaraProcess equipmentPanel-level CMP delivery

Master-P510APEX was reported shipped to an advanced-packaging production line for use.

reported [1] (source)
Commercial
Iluvatar CoreX天数智芯NVIDIA / AMDAI acceleratorsStrategic role

Commercial GPU compute platform

vendor [1] (source)
Commercial
InnoLight中际旭创CoherentOptical networkingStrategic position

Globally competitive optical-module supplier

vendor [1] (source)
Commercial
JCET长电科技ASE / Amkor / TSMC CoWoSAdvanced packagingXDFOI production status

Company reports that its high-density heterogeneous-integration platform reached volume production

vendor [1] (source)
Commercial
Kingsemi芯源微TELProcess equipmentStrategic role

Coat/develop and associated process equipment

vendor [1] (source)
Commercial
Kunlunxin昆仑芯Google TPU / AWS InferentiaAI acceleratorsArchitecture category

XPU AI accelerators

vendor [1] (source)
Commercial
Ligent TechnologiesCoherent / LumentumOptical networkingIPO capital for R&D and capacity

Raised HKD 5.67 billion; plans about 52.9% of net proceeds for product and chip R&D and 25.1% for capacity expansion

reported [1] (source)
Commercial
MetaX沐曦NVIDIA / AMDAI acceleratorsResearch status

Named commercial supplier; comparable independent benchmark still needed

reported [1] (source)
Scaling
Moore Threads摩尔线程NVIDIA / AMDAI acceleratorsAI software stackDelivered cluster contract

Company reports a RMB 660 million KUAE contract fully delivered and recognized in first-half revenue

vendor [1] (source)
Scaling
NAURA北方华创Applied Materials / Lam ResearchProcess equipmentDeployment scale

Company reports more than 1,000 cumulative deliveries each for etch, PVD and vertical furnace systems

vendor [1] (source)
Commercial
RSLaser北京科益虹源Cymer / Gigaphoton / TRUMPFOptics & light sourcesDevelopment focus

Stable high-power light sources for domestic lithography

reported [1] (source)
Development
SIOM上海光机所Advanced laser research ecosystemOptics & light sourcesResearch role

Advanced laser and optical research

primary [1] (source)
Research
Skyverse中科飞测KLA / Hitachi High-TechInspection & metrologyPortfolio milestone

Optical inspection and electron-beam dimensional metrology listed

vendor [1] (source)
Commercial
SMEE上海微电子ASML / NikonLithographyPublic evidence

Commercial lithography portfolio; advanced immersion qualification remains the key test

vendor [1] (source)[2] (source)
Commercial
SMIC中芯国际TSMCFoundryIndependent process evidence

N+3: improved 7nm-family process

measured [1] (source)
Commercial
Alibaba T-Head阿里平头哥Google TPU / AWS TrainiumAI acceleratorsReported deployment scale

More than 560,000 Zhenwu units shipped; over 400 external customers across 20 industries

reported [1] (source)[2] (source)
Commercial
YMTC长江存储Samsung / Kioxia / MicronMemory & storageTechnology

Separate memory-cell and logic wafers, bonded together

vendor [1] (source)
Commercial
Yuliangsheng宇量昇ASML / NikonLithographyQualification stage

Fab testing reported in September 2026

reported [1] (source)[2] (source)
Development
Fujian Zhiqi PhotonicsZeissOptics & light sourcesDevelopment focus

Locally sourced alternatives to projection lenses

reported [1] (source)
Development

Latest developments

All news →
reported

Alibaba unveils Zhenwu V900 and advances commercial-release target

Alibaba unveiled T-Head's Zhenwu V900 and said mass production and commercial release are planned for Q1 2027, earlier than the Q3 2027 target reported in May. The company claims three times M890 performance and support for clusters of up to 500,000 chips, but did not disclose workload, precision, device memory, fabrication, power, topology, recovery or measured scaling data.

Why it matters. The revised schedule and proposed cluster scale strengthen T-Head's roadmap signal, not delivered performance or supply-chain sovereignty. Preserve the May roadmap as a dated historical claim and watch for production qualification, customer acceptance and reproducible model results.

Reuters · Alibaba deepens AI push with new chip, bigger model; shares jump 5% (source)
reported

Ligent raises HKD 5.67 billion for optical R&D and capacity

Ligent Technologies completed its Hong Kong listing after raising HKD 5.67 billion. Reuters reports that about 52.9% of net proceeds are planned for faster optical products and chip R&D and 25.1% for production-capacity expansion. First-half revenue was RMB 5.39 billion and net profit RMB 661 million.

Why it matters. The financing can expand China's optical-module and related chip capacity, but capital raised is not evidence of high-speed product qualification or domestic component provenance. Reuters cited an analyst saying the current shipment mix remains weighted toward the lower end of the module range.

Reuters · China's Ligent jumps 19% in Hong Kong debut as AI demand draws investors (source)Ligent Technologies · Ligent Technologies high-speed optical product portfolio (source)
reported

CXMT says its fifth-generation DRAM platform and 24 Gb LPDDR5X entered mass production

At the 2026 World Manufacturing Convention, CXMT said its fifth-generation DRAM platform had entered mass production using quadruple patterning and an 11.95 nm active-area half-pitch. The company also said two 24 Gb LPDDR5X products made on the platform were in mass production.

Why it matters. This is a material claimed density and manufacturing milestone for China's commodity DRAM base, but not an HBM milestone or an independent yield result. CXMT's claim of at least 50% more gross dies per wafer than its fourth-generation platform measures potential dies before defects are excluded. The company said it worked with Chinese equipment makers on critical steps without naming them or establishing a fully domestic process flow.

Reuters · China's CXMT says new memory-chip platform enters mass production (source)